Volume 26, Issue 3 (8-2013)                   jdm 2013, 26(3): 178-184 | Back to browse issues page

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Abdolrahim D, Alireza Danesh K, Majid M, Najmeh Pour M. Comparison of solvent evaporation in the self etch and total etch adhesives in different air draying times. jdm. 2013; 26 (3) :178-184
URL: http://jdm.tums.ac.ir/article-1-5046-en.html
Abstract:   (12334 Views)

  Background and Aims: Different adhesives with different solvents may have different solvent evaporation rates. The purpose of this study was to evaluate the solvent evaporation in the self etch and total etch adhesive in different air drying times.

  Materials and Methods: Five adhesives were used in this study: Excite, Prime & Bond NT, UNO, Single Bond, SE Bond Primer. Twelve drops of each adhesive were used for each period of air drying (5, 15, 30 sec). The percentage of mass loss was measured during each test. Data were analized using two-way ANOVA and Tukey.

  Results: Acetone base adhesives showed more loss of mass than other adhesives (P<0.01). P&B NT showed more loss of mass than other adhesives in all air drying times (P<0.01). Adhesives showed different evaporation rates in different air times (P<0.01).

  Conclusion: Adhesives with acetone/water or alcohol/water solvent shows more stable behavior in comparison with adhesives containing pure aqueous solvents.

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Type of Study: Research | Subject: general
Received: 2013/02/23 | Accepted: 2013/09/17 | Published: 2013/09/30

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